BOE Technology Group Co., Ltd., founded in April 1993, is an IoT company providing intelligent interface products and professional services for information interaction and human health. BOE’s three core businesses are Interface Devices, Smart IoT Systems and Smart Medicine & Engineering Integration.
In 2019, BOE’s yearly new-patent applications amounted to 9657, of which over 90% are invention patents, amounting to over 70,000 usable patents in total. Data from IFI Claims also shows that BOE has ranked 13th among the Top 50 USPTO (The United States Patent and Trademark Office) Patent Assignees in 2019. According to the 2019 International PCT Applications of WIPO, BOE ranked No.6 with 1,864 applications.
BOE has manufacturing bases located in Beijing, Hefei, Chengdu, Chongqing, Fuzhou, Mianyang, Wuhan, Kunming, Suzhou, Ordos, Gu’an, etc. BOE boasts a global marketing and R&D centers in 19 countries and regions like the United States, Germany, the United Kingdom, France, Switzerland, Japan, South Korea, Singapore, India, Russia, Brazil and Dubai, with its service networks covering the world's major areas such as Europe, America, Asia and Africa.
Hardware R&D Engineer
1. Structural design: design consumer electronics/commercial equipment structural solutions based on technology and product definitions, and complete prototype production and verification;2. Circuit design: carry out circuit technology development of related products, analog and digital circuit design;3. Embedded development: FPGA chip development, embedded application software development, joint debugging drive;4. Hardware design: the development and design of sensor-related products such as Sensor Panel and liquid crystal phase shifter;5. Microelectronics research: integrated circuit module design, circuit simulation, performance optimization, design rule formulation;6. Optical research: responsible for overall optical design, integrated circuit module design, circuit simulation, performance optimization, and design rule formulation.
1. Master's degree and above; 2. Electronic engineering, microelectronics, optics, communication engineering, mechatronics, mechanical engineering, automation, electromagnetic field and microwave technology, materials, chemistry and other related majors;3. Have rigorous logic, organization, coordination and communication skills, and have the courage to take on work pressure and challenges;4. Familiar with office software, overseas study experience, good English ability, and ability in other languages (Japanese, Korean) is preferred.